Thin Film Deposition丨Principles and Applications of Magnetron Sputtering Technology

Magnetron sputtering is a physical vapor deposition (PVD) process that belongs toOne of the vacuum deposition processesIt is widely used in industrial coating because of its low deposition temperature, good film quality, uniformity, fast deposition speed and the ability to produce large areas of uniform and dense films. It is widely used in industrial coating because of its many advantages such as low deposition temperature, good film quality, good uniformity, fast deposition speed, and the ability to prepare large-area uniform and dense hard films.

The name "magnetron sputtering" comes from the use of a magnetic field to control the behavior of charged ion particles during magnetron sputtering deposition. The process requires a high vacuum chamber to create a low pressure environment for sputtering.First, putThe gas containing the plasma (usually argon) enters the chamber.A high negative voltage is applied between the cathode and anode to initiate the ionization of the inert gas. The positive argon ions from the plasma collide with the negatively charged target. Each collision of the energetic particles causes atoms from the target surface (target) to be ejected into the vacuum environment and propelled onto the substrate surface.Strong magnetic fields produce high plasma densities by confining electrons near the target surface (target), increasing the deposition rate and preventing damage to the substrate from ion bombardment. Most materials can be used as targets for sputtering processes because magnetron sputtering systems do not require melting or evaporationSource Material.