Micro and Nano Processing | Polymer Light Emitting Device Fabrication
微纳加工 | AIE聚合物发光器件制作 微纳发光器件在集成光学发展过程中扮演着重要的角色，比如：光增益材料在有 […]
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Micro and Nano Processing | Cellular patterning of protein micro and nano structures
Micro-Nano Processing| Protein-based Micro-Nano Device Chip Fabrication In recent years, due to the development of portable devices. People pay more attention to the flexibility of electronic devices. Especially in the Internet
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Micro and Nano Processing | Microfluidic Chips
Microprocessing | Microfluidic Chips Microfluidic chips have become a powerful tool for studying biological systems at single-cell resolution. At the same time, microfluidic chips can not only be widely
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MEMS Foundry Capabilities | Photolithography Plating Etching Coating
Micro-nano structure/MEMS foundry platform technology capability The laboratory platform has a total of more than 200 pieces of equipment, including the main equipment (more than 40 pieces) including: - Graphics
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UV-LIGA Electroforming | Preparation of fine metal mesh panels with large thickness and high porosity
UV-LIGA Electroforming | Manufacture of Metal Array Stencils Currently the main process technologies for the preparation of fine metal stencils are: photolithography-etching, laser processing and photolithography.
LIGA Plating | Machining metal microstructures, inertial sensing/RF/heat sink parts
LIGA/UV-LIGA Plating | Metal Microstructures RF Devices Inertial Sensors Heat Dissipation Microstructural Applications Microsystems, Inc.
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Micro and Nano Processing | For Cellular Arraying
Micronanofabrication | For Cell Arraying Cell microarraying (or cell patterning) 'is also known as constraining the cells under study to a defined spatial location' it
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Micro and Nano Processing | Preparation of Micro and Nano Optical Components
Micro-Nano Processing | Preparation of Micro-Nano Optical Elements Micro-Nano Optical Elements are free-form optical surfaces and micro-junctions with sub-micron surface accuracy and nanometer surface roughness.
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Micro and Nano Processing | MEMS Fine Processing (VII)
Micro-Nano Processing | MEMS Fine Processing (VII) 1.10 Bonding Technology Wafer bonding is similar to soldering in that no adhesive is used and the material layers are melted together to form a bond.
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Micro and Nano Processing | MEMS Fine Processing (VI)
Micro-Nano Processing | MEMS Fine Processing 1.6 Sacrificial Layer Technology Sacrificial layer technology is also known as separation layer technology. Sacrificial layer technology involves the use of a chemical vapor (CV) on a silicon substrate.
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